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We advise the sole sponsor South China Capital Limited and underwriters in relation to the listing of Niche-Tech Group Limited on GEM of the Hong Kong Stock Exchange by way of share offer.
Niche-Tech is an established semiconductor packaging materials manufacturer specialising in the development, manufacture and sales of bonding wire and encapsulant with headquarters in Hong Kong and production facilities in Shantou, the PRC.
Niche-Tech ranked seventh among all the bonding wire manufacturers and second among all Chinese branded bonding wire manufacturers in Mainland China in terms of sales revenue, respectively, and was also the largest bonding wire manufacturer based in Hong Kong in terms of sales revenue in Mainland China in 2017, according to a market research report commissioned by Niche-Tech.
Niche-Tech published its IPO prospectus on 17 May 2018, seeking to raise up to HK$98.6 million (subject to the exercise of offer size adjustment option). Dealings in its shares on GEM of the Hong Kong Stock Exchange are expected to commence on 30 May 2018.
Our team is led by Kelvan Cheung, Partner of our Corporate Finance Practice Group.
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